| 摘要 |
A probe card and a testing method using the probe card, for testing each chip of a plurality of chips or CSPs (Chip Size Packages) formed on a wafer, in the intact condition of the wafer. The probe card has a flexible contact board, a plurality of contact electrode groups provided in a predetermined layout on the contact board, a rigid base provided on the contact board between the contact electrode groups, having apertures exposing the contact board in areas where the contact electrodes are formed, and wiring provided on the contact board and connected to the contact electrodes. The probe card can attain good contact conditions with each chip and electrode pads of CSPs when testing the chips and/or CSPs in the intact wafer condition. <IMAGE> |
