发明名称 |
Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device |
摘要 |
A semiconductor device that is resin-sealed in a wafer level after a rewiring layer forming process and a metal post forming process forming a metal post are performed on a semiconductor substrate of the semiconductor device includes devices formed on the semiconductor substrate. Further all of the devices are disposed in respective positions other than positions overlapping a peripheral border of the metal post when viewed from a top of the semiconductor substrate. |
申请公布号 |
US8716874(B2) |
申请公布日期 |
2014.05.06 |
申请号 |
US201113228583 |
申请日期 |
2011.09.09 |
申请人 |
KONISHI JUNICHI;UEDA NAOHIRO;RICOH COMPANY, LTD. |
发明人 |
KONISHI JUNICHI;UEDA NAOHIRO |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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