METHOD FOR MOLDING THERMOPLASTIC RESIN PRODUCT AND MOLDING APPARATUS THEREFOR

摘要

An apparatus for molding a thermoplastic resin product includes a heating apparatus which conducts heating by radiation of infrared rays by using a light source; a stamper which is radiation heated by infrared rays radiated from the light source; a cooling member which cools the stamper by contacting the stamper which is radiation heated; a first mold which holds the stamper and/or the cooling member in a movable manner, thereby enabling the stamper and the cooling member to be in contact with or remote from with each other; and a second mold which holds a thermoplastic resin to which a structure of a shape-forming surface of the stamper is transferred. The stamper is radiation heated at least in the state where it is remote from the cooling member.