发明名称 |
Printed wiring board with reinforced insulation layer and manufacturing method thereof |
摘要 |
A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to form a roughened portion on the surface. An outer insulation layer including a reinforcing material is formed on the surface of the inner insulation layer having the roughened portion. |
申请公布号 |
US8710374(B2) |
申请公布日期 |
2014.04.29 |
申请号 |
US20090360181 |
申请日期 |
2009.01.27 |
申请人 |
TSUKADA KIYOTAKA;SUGIURA TAKAMICHI;IBIDEN CO., LTD. |
发明人 |
TSUKADA KIYOTAKA;SUGIURA TAKAMICHI |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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