| 发明名称 |
METHOD FOR ADHEHRING TWO ELEMENTS AND SUBSEQUENTLY SEPARATING THEM |
| 摘要 |
<p>A process and device for separating two semi-conductor substrate wafers along an interface. The process includes forming a cavity, and initiating separation by applying force to the interface through the cavity. The device utilizes fluid or gas, and pressure chambers, to subject adherent faces of the interface to at least one of chemical or mechanical action.</p> |
| 申请公布号 |
EP1192644(B1) |
申请公布日期 |
2014.04.16 |
| 申请号 |
EP20000951659 |
申请日期 |
2000.07.12 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES |
发明人 |
RAYSSAC, OLIVIER;MORICEAU, HUBERT;ASPAR, BERNARD;MONTMAYEUL, PHILIPPE |
| 分类号 |
H01L21/67;H01L21/683;H01L21/00;H01L21/02;H01L27/12 |
主分类号 |
H01L21/67 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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