| 摘要 |
PROBLEM TO BE SOLVED: To ensure good bondability of a heat transfer material to a semiconductor chip to ensure good heat radiation performance of heat generated at the semiconductor chip.SOLUTION: A semiconductor device comprises: a wiring board which has a plurality of insulation layers and a plurality of wiring layers which are alternately stacked one by one and the wiring layers are connected with each other by via plugs; a semiconductor chip mounted on the wiring board; a heat radiation member arranged on the opposite side to the wiring board across the semiconductor chip, for radiating heat generated at the semiconductor chip; an encapsulation resin layer which is bonded to the wiring board and the heat radiation member, for encapsulating the semiconductor chip from an outer periphery side; and a heat transfer material which is bonded to the semiconductor chip and the heat radiation member inside the encapsulation resin layer, for transferring heat generated at the semiconductor chip to the heat radiation member. The heat radiation member includes a through hole communicated with the heat transfer material. |
