| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting element mounting substrate which exhibits excellent bondability of bonding wire, can enhance luminous efficiency of the light-emitting element, and can be manufactured at a low cost.SOLUTION: A light-emitting element mounting substrate 10 can bring a wiring conductor pattern 12 provided at least on one principal surface of calcined ceramic substrate 11, and a light-emitting element 13 to be mounted on the ceramic substrate 11 into electrical connection state via a bonding wire 14. The light-emitting element mounting substrate 10 has, on the entire surface of the calcined ceramic substrate 11 on the side provided with the wiring conductor pattern 12, a glass layer 15 formed by applying and calcining a glaze, and a wiring conductor pattern 12 of a gold film formed by applying gold resinate in the shape of the wiring conductor pattern 12 on the upper surface of the glass layer 15 and then calcining the gold resinate. Surface of the wiring conductor pattern 12 has a center line average roughness equivalent to that of the surface of the glass layer 15. |
