| 摘要 |
<p>A semiconductor unit includes a base, an insulting substrate attached to the base, a conductive plate made of weaken soldering metal, a semiconductor device which is mounted on the insulting substrate through the conductive plate, and a metal plate which is interposed between the conductive plate and the semiconductor device and made of good soldering metal compared to the metal used for the conductive plate. The base, the insulating substrate, the conductive plate, and the metal plate are brazed together and the semiconductor device is soldered to the metal plate.</p> |
