发明名称 METHOD OF REMOVING IMPURITIES FROM PLATING LIQUID
摘要 Impurities are removed from tin plating liquids by adding additives containing aromatic organic sulfonic acids or salts thereof to the tin plating liquids containing nonionic surface active agents and thiourea or thiourea compounds and producing a precipitate by cooling.
申请公布号 US2014083322(A1) 申请公布日期 2014.03.27
申请号 US201213625126 申请日期 2012.09.24
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 HAKIRI YOSHIYUKI
分类号 C09D1/00 主分类号 C09D1/00
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