| 摘要 |
A semiconductor device includes a semiconductor module and a pressing member configured to press the semiconductor module to a heat radiation member. The semiconductor module includes switching elements, conductors, and a molded member. Each of the switching elements is mounted on a corresponding one of the conductors. The molded member covers the switching elements and the conductors. More than three of the switching elements are disposed around the pressing member. The switching elements are disposed in a region in which a pressure generated between the semiconductor module and the heat radiation member by pressing with the pressing member is greater than or equal to a predetermined pressure with which heat generated from the switching elements is releasable from the semiconductor module to the heat radiation member. |
