发明名称 |
Sensor package |
摘要 |
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements. |
申请公布号 |
US8674462(B2) |
申请公布日期 |
2014.03.18 |
申请号 |
US20070828085 |
申请日期 |
2007.07.25 |
申请人 |
WOMBACHER RALF;THEUSS HORST;INFINEON TECHNOLOGIES AG |
发明人 |
WOMBACHER RALF;THEUSS HORST |
分类号 |
H01L29/84;H01L21/56;H01L31/0203 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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