发明名称 SEMICONDUCTOR PRODUCTION TREATMENT SYSTEM AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor production treatment system in which the time required until the operating state after QC work can be shortened when a member is replaced.SOLUTION: A wafer processing apparatus 30 includes number of processed wafer counting means for counting the number of processed wafers while integrating, and maintenance post-processing means performing dummy lot processing using a dummy lot and QC lot processing using a QC lot after ending the maintenance processing in the wafer processing apparatus 30. When a first number of processed wafers is counted by the number of processed wafer counting means, a wafer preparation device 10 prepares a dummy lot and a QC lot. When a second number of processed wafers is counted by the number of processed wafer counting means, a transfer device 50 transfers a dummy lot and a QC lot to the wafer processing device 10, before the maintenance processing ends, in parallel with the maintenance processing of the wafer processing device 10.
申请公布号 JP2014049502(A) 申请公布日期 2014.03.17
申请号 JP20120189193 申请日期 2012.08.29
申请人 TOSHIBA CORP 发明人 OKADA EIICHI
分类号 H01L21/02;H01L21/304;H01L21/677 主分类号 H01L21/02
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