发明名称 |
Chipset package structure |
摘要 |
A chipset package structure includes a carrier, a plurality of pinouts, at least one semiconductor package preforms, at least one electromagnetic shielding layer and a protective layer. The pinouts are disposed on the carrier. The semiconductor package preforms is disposed on the second surface of the carrier and electrically connected to the pinouts. The electromagnetic shielding layer is disposed on the semiconductor package preforms and the electromagnetic shielding layer. At least one of the electromagnetic shielding layers comprises a carbon nanotube film structure. The protective layer covers the electromagnetic shielding layer. |
申请公布号 |
US8659125(B2) |
申请公布日期 |
2014.02.25 |
申请号 |
US20080248799 |
申请日期 |
2008.10.09 |
申请人 |
CHEN WEN-HUA;FENG ZHENG-HE;CHUANG PING-YANG;TSINGHUA UNIVERSITY;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
CHEN WEN-HUA;FENG ZHENG-HE;CHUANG PING-YANG |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|