发明名称 |
Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same |
摘要 |
A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto. |
申请公布号 |
US8647976(B2) |
申请公布日期 |
2014.02.11 |
申请号 |
US201213348767 |
申请日期 |
2012.01.12 |
申请人 |
SONG EUN-SEOK;KIM DONG-HAN;LEE HEE-SEOK;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG EUN-SEOK;KIM DONG-HAN;LEE HEE-SEOK |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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