发明名称 |
Semiconductor manufacturing apparatus |
摘要 |
To project a rectangular laser spot having a predetermined size and a high laser power density onto the surface of an object, a semiconductor manufacturing apparatus comprises a control unit for controlling power of a laser light source, an optical waveguide unit (1) including a core section (10) transmitting laser light and a clad section (11) covering the core section (10), and a lens (3) for forming the laser light output through the optical waveguide unit (1) into a laser spot having a predetermined shape, an output end surface (15) of the core section (10) has a rectangular shape with one side length of 1 mum to 20 mum and the other side length of 1 mm to 60 mm, and the laser source is set to make the power density of the laser spot output from the core section (10) to be 0.1 mW/mum2 or more. |
申请公布号 |
US8644665(B2) |
申请公布日期 |
2014.02.04 |
申请号 |
US200813059297 |
申请日期 |
2008.09.29 |
申请人 |
OGINO YOSHIAKI;KIMURA KATSUMI;IIDA YASUHIRO;SOGA KAZUHIRO;HITACHI INFORMATION & TELECOMMUNICATION ENGINEERING, LTD. |
发明人 |
OGINO YOSHIAKI;KIMURA KATSUMI;IIDA YASUHIRO;SOGA KAZUHIRO |
分类号 |
H01S3/30;G02B6/036;G02B6/10 |
主分类号 |
H01S3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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