发明名称 Semiconductor manufacturing apparatus
摘要 To project a rectangular laser spot having a predetermined size and a high laser power density onto the surface of an object, a semiconductor manufacturing apparatus comprises a control unit for controlling power of a laser light source, an optical waveguide unit (1) including a core section (10) transmitting laser light and a clad section (11) covering the core section (10), and a lens (3) for forming the laser light output through the optical waveguide unit (1) into a laser spot having a predetermined shape, an output end surface (15) of the core section (10) has a rectangular shape with one side length of 1 mum to 20 mum and the other side length of 1 mm to 60 mm, and the laser source is set to make the power density of the laser spot output from the core section (10) to be 0.1 mW/mum2 or more.
申请公布号 US8644665(B2) 申请公布日期 2014.02.04
申请号 US200813059297 申请日期 2008.09.29
申请人 OGINO YOSHIAKI;KIMURA KATSUMI;IIDA YASUHIRO;SOGA KAZUHIRO;HITACHI INFORMATION & TELECOMMUNICATION ENGINEERING, LTD. 发明人 OGINO YOSHIAKI;KIMURA KATSUMI;IIDA YASUHIRO;SOGA KAZUHIRO
分类号 H01S3/30;G02B6/036;G02B6/10 主分类号 H01S3/30
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