发明名称 |
Capturing mutual coupling effects between an integrated circuit chip and chip package |
摘要 |
Systems and methods are provided for capturing mutual coupling effects between an integrated circuit chip and chip package using electronic design automation (EDA) tools. Specifically, a method is provided that is implemented in a computer infrastructure for designing an integrated circuit chip. The method includes compiling process technology parameters that describe electrical behavior for a chip-package coupling and a package of the integrated circuit chip. The method also includes generating a parasitic technology file to include the compiled process technology parameters. |
申请公布号 |
US8640077(B1) |
申请公布日期 |
2014.01.28 |
申请号 |
US201213561760 |
申请日期 |
2012.07.30 |
申请人 |
GROVES ROBERT A.;NI WAN;ST. ONGE STEPHEN A.;XU JIANSHENG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GROVES ROBERT A.;NI WAN;ST. ONGE STEPHEN A.;XU JIANSHENG |
分类号 |
G06F17/50;G06F9/455;G06F11/22 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|