SEMICONDUCTOR PACKAGE FOR FINGERPRINT RECOGNITION AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor package for fingerprint recognition includes a first base having a via for a first signal line, a semiconductor die bonded to the position of a first base, a wire connected between the electrode base of the first base and the die pad of the semiconductor die, a second base having a via for a second signal line, stacked on the first base, and having the semiconductor die in a cavity and a third base having a via for a third signal line, stacked on the second base, and having a sensor layer for fingerprint recognition connected to one side of a via of the third signal line.