| 摘要 |
A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating. |
