| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation epoxy resin molding material having excellent flowability.SOLUTION: An encapsulation epoxy resin molding material includes (A) an epoxy resin, (B) a hardener, and (C) a silane compound represented by the following general formula (I), where Rand Rindependently represent a 2-5C hydrocarbon group, Rrepresents a 1C or 2C hydrocarbon group, and p represents 2 or 3. |
