| 摘要 |
The present invention relates to an integral release film for a flexible printed circuit board process and a method of manufacturing the same and, more specifically, to a release film for a flexible printed circuit board having properties such as excellent buffering properties, thermal resistance properties, releasing properties, and mechanical strength, etc. According to the present invention, the thickness is thin, and workability is excellent in comparison with a structure where a conventional functional film is multi-layer laminated. Manufacture costs are inexpensive since a process is removed by elongating conventional films, and easiness of a process is promoted since manufacturing is possible in a small space. Provided is a release film for a flexible printed circuit board process. |
