| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving both of property and uniformity of a deposition film.SOLUTION: A deposition film forming method includes steps of installing, in a reaction container capable of being at a reduced pressure, an auxiliary substrate which comes in contact with the cylindrical substrate and an upper part and/or a lower part of the cylindrical substrate, and forming a deposition film on a surface of the cylindrical substrate by vapor deposition method; wherein the auxiliary substrate has an outer circumferential surface, an end face, and a chamfer surface formed between the end face and circumferential surface; polishing treatment with a polishing member is applied to at least the end face which is in contact with the cylindrical substrate, before repeatedly using the auxiliary substrate so as to perform regeneration processing so that an arithmetic average roughness Ra of the end face, regulated by JIS B0601:2001, falls within a range of 0.01 μm or more and 1.00 μm or less. |
