| 摘要 |
The present invention relates to an apparatus for inspecting a sapphire wafer and, more specifically, to a sapphire wafer inspecting apparatus which inspects defects on a surface of a sapphire wafer such as scratches, fine particles, or cracks by emitting light onto a sapphire wafer using a laser device and obtaining the image by a scan camera. The sapphire wafer inspecting apparatus according to the present invention comprises a fixing frame (F); a base (B) which is supported by the fixing frame (B); a back inspecting unit (12) which is installed on the top of the base (B) and includes a back light (124) emitting light onto the sapphire wafer and an optical camera (125); a front inspecting module (11) on which the sapphire wafer, which is delivered after passing through the back inspecting unit (12), is mounted; a laser module (13) which is installed at one side of the front inspecting module and emits laser light onto the front inspecting module (11); and a front camera module (14) which obtains an image of the sapphire wafer from the laser light reflecting off the front inspection module (11), wherein the front inspecting module (11) is able to rotate, and the laser module (13) and front camera module are able to move up and down or from side to side. |
