| 摘要 |
One automated process for evenly applying a thin layer within a device housing includes applying a vacuum hold from a curved surface applicator to the thin layer, pressing the thin layer against the device housing with the applicator, wherein said pressing includes applying pressure from the center of the applicator first and then radially expanding said pressure, and pressing the cylindrical outer housing against an outer region of the thin layer to effect a hard pressed application at the outer surface thereof. |
