| 摘要 |
The present invention provides a module for mounting a semiconductor LED capable of achieving a superior heat radiating property, having a greatly-reduced risk of short circuiting even in the case that a conductive member such as a heat radiating plate is closely installed thereon, and being accurately and simply mounted to the side of a liquid crystal panel unit and a semiconductor LED module. The module for mounting the semiconductor LED according to the present invention includes: a metallic conductive plate (17) having an anode terminal (21) and a cathode terminal (25) on one side, connectable to an anode (58) and a cathode (59) of the semiconductor LED (57), respectively; a metallic heat radiation member (45) spaced apart from the conductive plate; and surface insulation parts (37, 50) covering the surface of the conductive plate and the heat radiation member while exposing at least a part of the heat radiation member, the cathode terminal, and the anode terminal. Clasping plates (51A, 51B) connected to a light receiving member (100) for receiving lights generated from the semiconductor LED are protruding toward one side and the other side of the surface insulation part and are formed at a position covering one side of the surface insulation part while facing each other across the cathode terminal contact and the anode terminal contact. [Reference numerals] (AA) Up;(BB) Right;(CC) Down;(DD) Left |
