POROUS PLATE-SHAPED FILLER, COATING COMPOSITION, HEAT-INSULATING FILM, AND HEAT-INSULATING FILM STRUCTURE

摘要

Provided are a heat-insulating film and a heat-insulating film structure with improved heat-insulating effects. Further provided are a porous plate-shaped filler contained in the heat-insulating film and a coating composition for forming the heat-insulating film. In this heat-insulating film (3), porous plate-shaped fillers (1) are diposed dispersed in a matrix (3m) for binding the porous plate-shaped fillers (1). It is preferable for the heat-insulating film (3) to have the porous plate-shaped fillers (1) disposed (laminated) therein in a layered form. The porous plate-shaped filler (1) is in the shape of a plate with an aspect ratio of at least 3, with a shortest length of 0.1-50 µm and a porosity of 20-99%. The heat-insulating film (3) in which the porous plate-shaped fillers are used enables the heat transfer route to be longer and the thermal conductivity to be lower than a case of using spherical or cubical fillers.