发明名称 REINFORCING STRUCTURE FOR ELECTROFORMED MOLD
摘要 PROBLEM TO BE SOLVED: To provide a reinforcing structure for an electroformed mold in which a plate member is provided at any part in a wide range regardless of a position of a flow path pipe provided on a back surface of an electroformed mold.SOLUTION: A reinforcing structure for an electroformed mold 1 includes: an electroformed mold 2 formed through electroforming processing and having a flow path pipe 4 provided on a back surface thereof; and a backup member 3 lined with the back surface of the electroformed mold 2. A frame 6 for supporting the electroformed mold 2 is installed on the back surface of the electroformed mold 2. A plate member 7 is provided on the back surface of the backup member 3. A shaft member 8 is provided between the plate member 7 and the frame 6.
申请公布号 JP2013256054(A) 申请公布日期 2013.12.26
申请号 JP20120133084 申请日期 2012.06.12
申请人 PANASONIC CORP 发明人 KAWAMURA MASAHIDE
分类号 B29C33/38 主分类号 B29C33/38
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