| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounted element used for surface mounting, which can quickly rise a temperature of solder paste.SOLUTION: A surface-mounted element includes: a body part 2 having an element for exhibiting a function; a plurality of lead parts 3 which are portions for soldering the body part 2 to a print circuit board 5. The surface-mounted element is surface-mounted on the print circuit board 5. A flat surface part 3a, which is a surface facing the print circuit board 5 in a mounted state, in each of the multiple lead parts 3 includes a protrusion 3b protruding toward the print circuit board 5. In the protrusion 3b, an area of a cross section (a circle) on a flat plate perpendicular to a protruding direction of the protrusion 3b is gradually increased from a top portion side of the protrusion 3b toward a base portion side (namely the flat surface part 3a side). |
