| 摘要 |
Provided are a shield film having good shielding characteristics in the high frequency region, and a shield printed wiring board. A shield film, provided with, in a layered state: a plurality of metal layers (12, 14) (metal thin film (12), metal foil (14)); an insulating layer (13) disposed between the metal layers; and an electroconductive adhesive layer (15) disposed on the surface of the metal foil (14), from amongst the metal layers (12, 14), on which the insulating layer (13) is not disposed. |
