THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

摘要

A three-dimensional chip stack includes a first chip bonded to a second chip. The first chip includes a first bump structure placed on a first substrate. The second chip includes a second bump structure placed on a second substrate. The first bump structure is bonded to the second bump structure and is formed between the first bump structure and the second bump structure. The noble metal combination region is included in the solderless region.