发明名称 BARRIER ASSEMBLY
摘要 An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
申请公布号 KR20130128359(A) 申请公布日期 2013.11.26
申请号 KR20137002510 申请日期 2011.07.01
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 WEIGEL MARK D.;ROEHRIG MARK A.;NACHTIGAL ALAN K.;KIDANE SAMUEL;HENDERSON ANDREW J.
分类号 B32B27/08;B32B7/12;B32B9/00;H01L31/042 主分类号 B32B27/08
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