发明名称 I/O MOUDLE OF ELECTRONIC DEVICE
摘要 An electronic device input and output (I/O) assembly includes a bracket, a first I/O module, and a second I/O module. The first I/O module includes a first connector. The second I/O module is detachably mounted to the first I/O module. The second I/O module includes a second connector. The second connector has a different type with the first connector. The bracket can mount both the first I/O module and the second I/O module to a bezel of an electronic device.
申请公布号 US2013309894(A1) 申请公布日期 2013.11.21
申请号 US201213715021 申请日期 2012.12.14
申请人 JIN PRECISION INDUSTRY (WUHAN) CO., LTD. HONG FU;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. 发明人 GENG CHAO;BIN QIU-HUA;WU TAI-BAO
分类号 H01R13/625 主分类号 H01R13/625
代理机构 代理人
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