发明名称 |
I/O MOUDLE OF ELECTRONIC DEVICE |
摘要 |
An electronic device input and output (I/O) assembly includes a bracket, a first I/O module, and a second I/O module. The first I/O module includes a first connector. The second I/O module is detachably mounted to the first I/O module. The second I/O module includes a second connector. The second connector has a different type with the first connector. The bracket can mount both the first I/O module and the second I/O module to a bezel of an electronic device.
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申请公布号 |
US2013309894(A1) |
申请公布日期 |
2013.11.21 |
申请号 |
US201213715021 |
申请日期 |
2012.12.14 |
申请人 |
JIN PRECISION INDUSTRY (WUHAN) CO., LTD. HONG FU;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD. |
发明人 |
GENG CHAO;BIN QIU-HUA;WU TAI-BAO |
分类号 |
H01R13/625 |
主分类号 |
H01R13/625 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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