| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate capable of actuating an electronic component with high reliability, a mounting structure, a manufacturing method of the wiring substrate, and a manufacturing method of the mounting structure.SOLUTION: A wiring substrate 4 includes a core substrate 7; and a first built-up layer 8a positioned on the core substrate 7, and mounted with an electronic component on an upper surface thereof. The core substrate 7 has a base body 9, and a plurality of power source through-hole conductors 10P penetrating the base body 9 in a thickness direction. The first built-up layer 8a has an insulation layer 11c thinner than the base body 9; and a plurality of power source pads 14P positioned on the insulation layer 11c, electrically connected to a power source terminal 6P of the electronic component, and electrically connected to the plurality of the power source through-hole conductors 10P. In a set of the power source pad 14P and the power source through-hole conductor 10P electrically connected with each other, a number of the power source through-hole conductors 10P is larger than a number of the power source pads 14P. |
