| 摘要 |
PROBLEM TO BE SOLVED: To provide a waterproof type electronic component capable of maintaining waterproofness even though a hot melt resin is contracted.SOLUTION: A hot melt resin 11 is filled into a gap part 7c comprising an exposure end face 2a of a body member 2 made of first resin and a housing part 7a of a case member 7 made of a second resin such that a plurality of terminals 3 and a connection part 8a between the plurality of terminals 3 and a plurality of wiring members 8 are covered, and materials are selected such that the critical surface tension of the second resin is smaller than the critical surface tension of the first resin. Accordingly, even in the case that the hot melt resin 11 is contracted to reduce volume, the hot melt resin 11 in contact with the housing part 7a of the case member 7 made of the second resin is removed, and the hot melt resin 11 in contact with the exposure end face 2a is not removed. Thus, watertightness between the exposure end face 2a and hot melt resin 11 is maintained, and water is not immersed into the plurality of terminals 3 covered with the hot melt resin 11 and the connection part 8a of the wiring members 8 connected to the plurality of terminals 3, Thus, the waterproofness is maintained. |
