发明名称 Method of fabricating gate electrode using a treated hard mask
摘要 A method for fabricating an integrated device is disclosed. In an embodiment, a hard mask layer with a limited thickness is formed over a gate electrode layer. A treatment is provided to the hard mask layer to make the hard mask layer more resistant to a wet etch solution. Then, a patterning is provided on the treated hard mask layer and the gate electrode to from a gate structure.
申请公布号 US8569185(B2) 申请公布日期 2013.10.29
申请号 US20100700862 申请日期 2010.02.05
申请人 YEH MATT;OUYANG HUI;CHUNG HAN-PIN;WANG SHIANG-BAU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 YEH MATT;OUYANG HUI;CHUNG HAN-PIN;WANG SHIANG-BAU
分类号 H01L21/31;H01L21/027;H01L21/3205;H01L21/425;H01L21/44;H01L21/469;H01L21/4763;H01L21/8238 主分类号 H01L21/31
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