发明名称 Metallic laminate and manufacturing method of light emitting diode package using the same
摘要 The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
申请公布号 US8568861(B2) 申请公布日期 2013.10.29
申请号 US201313784321 申请日期 2013.03.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHONG MYUNG GUN;HEO CHEOL HO;SON SANG HYUK;YOU DAE HYUNG
分类号 B32B15/00 主分类号 B32B15/00
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