发明名称 |
Metallic laminate and manufacturing method of light emitting diode package using the same |
摘要 |
The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
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申请公布号 |
US8568861(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201313784321 |
申请日期 |
2013.03.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHONG MYUNG GUN;HEO CHEOL HO;SON SANG HYUK;YOU DAE HYUNG |
分类号 |
B32B15/00 |
主分类号 |
B32B15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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