METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve a yield by performing a peeling process and a transferring process. CONSTITUTION: A first light emitting diode includes a first terminal and a second terminal. A first resin layer covers the first light emitting diode. A second resin layer covers a second light emitting diode. An organic compound layer (72) is installed between a first substrate (70) and an element layer (73). The organic compound layer includes a photocatalyst substance (71).