ROOM-TEMPERATURE BONDING APPARATUS

摘要

A room-temperature bonding apparatus is described, which includes a vacuum chamber, an evacuation apparatus evacuating the vacuum chamber, a pair of substrate holders arranged to face each other in the vacuum chamber, a pressure bonding mechanism connected to the substrate holder to bond substrates mounted on the respective substrate holders to each other and a physical sputtering source. The target to be irradiated with ion beams or atom beams emitted from the physical sputtering source is arranged in the vacuum chamber independently of the substrate holders, the pressure bonding mechanism and the physical sputtering source.