| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board capable of inexpensively manufacturing high quality semiconductor element connection terminals, and thereby capable of enhancing the mounting reliability of the semiconductor element.SOLUTION: A first metal layer 13 is formed on the outermost layer, and after separating a multilayer wiring board 60 where the first metal layer 13 is the bonding surface of a semiconductor element from a temporary wiring board, a photosensitive resin layer 51 is formed on the outermost first metal layer 13, and apertures 52 are formed in the photosensitive resin layer 51 by patterning. Subsequently, conductive balls 53 are mounted on the apertures 52 and fused by heat treatment thus forming a second metal layer 54. Thereafter, the photosensitive resin layer 51 is removed. Finally, the first metal layer 13 is removed excepting that located directly under the second metal layer 54. Consequently, a multilayer wiring board 33 having semiconductor element connection terminals 55 is obtained. A plurality of steps carried out in the conventional manufacturing method become unnecessary. |
