| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device with improved dust resistance while restraining costs from increasing.SOLUTION: An electronic device comprises: a substrate on which an electronic component and connectors 5 are mounted; a case 3 housing and fixing the substrate; and a cover blocking the case 3. Openings for connectors to direct the connectors 5 outward are formed on the case 3 and the cover. A connector surrounding wall 9 constituting one part of the opening for the connector and surrounding one part of the connector 5 is provided on the cover. The connector surrounding wall 9 comprises a surrounding wall body 10, and a thin film section 11 extending outward from the surrounding wall body 10 and thinner than the surrounding wall body 10. |
