发明名称 |
Photocurable dicing die bonding tape |
摘要 |
A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
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申请公布号 |
US8546485(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201313785488 |
申请日期 |
2013.03.05 |
申请人 |
HENKEL CORPORATION |
发明人 |
LEE BYOUNGCHUL;CHIANG PAULINE;BECKER KEVIN HARRIS |
分类号 |
C09J175/06;C09J133/08;C09J183/04 |
主分类号 |
C09J175/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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