发明名称 Photocurable dicing die bonding tape
摘要 A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.
申请公布号 US8546485(B2) 申请公布日期 2013.10.01
申请号 US201313785488 申请日期 2013.03.05
申请人 HENKEL CORPORATION 发明人 LEE BYOUNGCHUL;CHIANG PAULINE;BECKER KEVIN HARRIS
分类号 C09J175/06;C09J133/08;C09J183/04 主分类号 C09J175/06
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