| 摘要 |
To cut a sheet in response to the size of a plate-like member in a state of sticking to the plate-like member a sheet of the size projecting from the outer periphery of the plate-like member such as a wafer. This sheet cutting method cuts the sheet S of the size projecting from the outer periphery of a semiconductor wafer W by a cutter blade 12 along the outer periphery of the semiconductor wafer W. This cutting method presets a moving locus of a blade 12B as a normal locus so that the sheet S does not project from the semiconductor wafer W, and adjusts an attitude of the cutter blade 12 so as to become a predetermined twin angle [alpha]1, a camber angleα2 and a caster angleα3, in a process of being approached to the normal locus, after inserting the blade 12B of the cutter blade 12 into a cutting starting position P separated from the normal locus in cutting. |
