SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME

摘要

PURPOSE: A semiconductor package and a display device including the same are provided to distribute static electricity to a ground layer or to output the static electricity to the outside by including a via contact which electrically connects a wiring pattern to the ground layer in a non-mounting area. CONSTITUTION: A base film (20) has a first surface and a second surface which faces the first surface. The base film is composed of a first area and a second area. A wiring pattern is formed on the first surface of the base film in the second area. An insulation layer (26) is arranged on the wiring pattern of the second area. A ground layer (28) is arranged on the second surface of the base film. A semiconductor chip (10) is mounted on the first surface of the base film in the first area.