发明名称 |
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE |
摘要 |
A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed. |
申请公布号 |
EP2221666(B1) |
申请公布日期 |
2013.09.18 |
申请号 |
EP20080848939 |
申请日期 |
2008.11.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MATSUTANI, HIROSHI;UENO, TAKUMI;NICOLAS, ALEXANDRE;NANAUMI, KEN |
分类号 |
G03F7/023;G03F7/40;H01L23/31 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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