发明名称 POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE
摘要 A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.
申请公布号 EP2221666(B1) 申请公布日期 2013.09.18
申请号 EP20080848939 申请日期 2008.11.07
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 MATSUTANI, HIROSHI;UENO, TAKUMI;NICOLAS, ALEXANDRE;NANAUMI, KEN
分类号 G03F7/023;G03F7/40;H01L23/31 主分类号 G03F7/023
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