| 摘要 |
PROBLEM TO BE SOLVED: To suppress a bump from being released from a semiconductor chip by being deposited to a probe needle.SOLUTION: A plurality of bumps BMP (first bumps) are formed in an effective area CHA of a wafer WF. The bumps BMP are formed on an active surface side of a semiconductor chip. Further, a plurality of dummy bumps DBMP1 are formed in an ineffective area DCHA of the wafer WF. Among the dummy bumps DBMP1, a part of bumps positioned in the outer-most circumference are dummy bumps DBMP2 (second dumps) smaller than the other bumps. The dummy bumps DBMP2 cross an inner circumferential side edge of a shading member CVL in a planar view. The dummy bumps DBMP2 are formed on a third pad electrode PAD3. An insulator film SR for bump formation is removed from surfaces of the overall third pad electrode PAD3. |
