| 摘要 |
PROBLEM TO BE SOLVED: To suppress increase in temperature of a portion contacting an installation target as much as possible, without affecting external dimensions.SOLUTION: A heat radiator of a semiconductor element comprises: a cylindrical frame body including a base surface contacting a semiconductor element and an installation surface contacting an installation target on the outside; and a plurality of heat-radiating fins provided inside the frame body in the form of plates so as to protrude from a back side of the base surface toward a back side of the installation surface. A tip of at least some of the heat-radiating fins provided in a position overlapping with the semiconductor element is separated from the back side of the installation surface. |
