| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can form an alignment mark used for manufacturing of a back side illumination solid-state imaging device (semiconductor device) in a smaller number of processes.SOLUTION: A semiconductor device comprises: a semiconductor layer SL including a first principal surface S1 and a second principal surface S2 opposite to the first principal surface S1; a plurality of photodiodes PD formed in the semiconductor layer SL for performing photoelectric conversion; light-receiving lenses LNS arranged above the second principal surface S2 of the semiconductor layer SL for supplying light to the photodiodes PD; and an alignment mark MK formed inside the semiconductor layer SL. The alignment mark MK includes a projection PR which extends from the first principal surface S1 toward the second principal surface S2 and projects from the second principal surface S2 in a direction where the light-receiving lenses LNS are arranged. |
