发明名称 |
Method for forming die assembly with heat spreader |
摘要 |
<p>A first major surface of a semiconductor die (204) is attached onto a package substrate (202). A heat spreader (212) is attached to a second major surface of the semiconductor die. The second major surface is opposite the first major surface, and the semiconductor die, package substrate, and heat spreader form a die assembly (209). A die release film (214) conforms to a transfer mold (216). The transfer mold is closed around the die assembly such that the die release film is compressed against the heat spreader and a cavity (220) is formed around the die assembly. A thermoset material (222) is transferred into the cavity. The die assembly is released from the die release film and the transfer mold.</p> |
申请公布号 |
EP2631941(A2) |
申请公布日期 |
2013.08.28 |
申请号 |
EP20130151824 |
申请日期 |
2013.01.18 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HIGGINS, III, LEO M.;CARPENTER, BURTON J.;DAVES, GLENN G |
分类号 |
H01L23/433;H01L21/56 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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