发明名称 |
Package-in-Package Using Through-Hole Via Die on Saw Streets |
摘要 |
A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.
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申请公布号 |
US2013214385(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201313845409 |
申请日期 |
2013.03.18 |
申请人 |
STATS CHIPPAC, LTD.;STATS CHIPPAC, LTD. |
发明人 |
DO BYUNG TAI;KUAN HEAP HOE;CHOW SENG GUAN |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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