| 摘要 |
This semiconductor device is provided with an outer housing (1), a block module (2), and a control board (3) that controls a power semiconductor element (11a). The block module (2) has the power semiconductor element (11a) integrated therein, and has a second lead (4b) and a first lead (4a) led out therefrom. The outer housing (1) has an external connecting terminal (6a), which is in contact with the first lead (4a) of the block module (2) disposed in the outer housing, the second lead (4b) is connected to the control baord (3), and the first lead (4a) is bonded to the external connecting terminal (6a). |
