| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package equipped with a BGA connection structure capable of improving durability of temperature change while suppressing the risk of rework.SOLUTION: A ceramic package 10 includes: a ceramic substrate 1; a plurality of ball electrodes 3 provided on a first surface 1a of the ceramic substrate 1; and an adhesive 7 which is located on the first surface 1a of the ceramic substrate 1 and fixes the ball electrodes 3 by being provided around the ball electrodes 3. The adhesive 7 is formed to be lower than the ball electrodes in height from the first surface 1a. |
